Single Face FR2 PCB
Single Face FR2 PCB
| Parameter | Mass Production | Prototype Production |
| Number of Layers | 1-18 Layer PCB | 1-56 Layer PCB |
| Raw Material | FR-4, Metal Based PCB (Aluminum, Copper etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
FR-4, Metal Based PCB (Aluminum, Copper etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
| Max. Panel Size | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L |
| Max. PCB Thickness | 8.5mm | 8.5mm |
| Min. PCB Thickness | 2L: 0.3mm | 2L: 0.1mm |
| 4L: 0.4mm | 4L: 0.3mm | |
| 6L and above: 0.8mm | 6L and above: 0.8mm | |
| Min. Inner Layer Opening | 3 miles | 3 miles |
| Min. Path Thickness | 3/3 miles | 3/3 miles |
| Min. Road Distance | 3/3 miles | 3/3 miles |
| Min. Hole Diameter | 0.1mm | 0.1mm |
| Min. PTH Thickness | 25 μm | 25 μm |
| Min. Blind/Buried VIA Size | 0.1mm | 0.1 mm (1-18 Layers) |
| PTH Diameter Tolerance | ±0.076mm (±3mil) | ±0.076mm (±3mil) |
| NPTH Diameter Tolerance | ±0.05 mm (±2mil) | ±0.05 mm (±2mil) |
| Drill Deviation | ±0.05 mm (±2mil) | ±0.05 mm (±2mil) |
| Thick Copper Options | 6 OZ/175 μm | 13 OZ/455 μm |
| Min. S/M | 0.1 mm (4mil) | 0.1 mm (4mil) |
| Solder Mask Color | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple |
| Silkscreen Color | White, Black, Yellow, Red, Gray | White, Black, Yellow, Red, Gray |
| Surface Finish | HASL, Lead-Free HASL, ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), Hard Gold, ENEPIG, Immersion Silver, Immersion Tin, None (Bare Copper) | HASL, Lead-Free HASL, ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), Hard Gold, ENEPIG, Immersion Silver, Immersion Tin, None (Bare Copper) |
| Edge Cutting | CNC Routing, V-Groove, Beveling Punch, Chamfering | CNC Routing, V-Groove, Beveling Punch, Chamfering |
| Edge Cutting Tolerance | Up to 1.0 mm ±0.1 mm, Above 1.0 mm ±0.15 mm (±6mil) | Up to 1.0 mm ±0.1 mm, Above 1.0 mm ±0.15 mm (±6mil) |
| Peelable Mask | Top, Bottom, Double-Sided | Top, Bottom, Double-Sided |
| VIA Techniques | Tented, Open, Plugged, Buried Via, Filled Via (Resin filled) | Tented, Open, Plugged, Buried Via, Filled Via (Resin filled) |
| Advanced Features | Half Plated Hole, Halogen-Free, Edge Plating, Special Stack-Up, Press-Fit Holes, Carbon Ink, Via-in-Pad, Black Core Material | Half Plated Hole, Halogen-Free, Edge Plating, Special Stack-Up, Press-Fit Holes, Carbon Ink, Via-in-Pad, Black Core Material |
| Impedance Control | ±10% | ±7% |
| Insulation Resistance | 1×1012 Ω (Normal) | 1×1012 Ω (Normal) |
| Hole Conductivity | <300 Ω (Normal) | <300 Ω (Normal) |
| Thermal Endurance | 3×10 sec@288℃ | 3×10 sec@288℃ |
| Bending/Flexing Tolerance | ≤0.7% | ≤0.7% |
| Electric Power | >1.3 KV/mm | >1.4 KV/mm |
| Peeling Strength | 1.4 N/mm | 1.4 N/mm |
| Solder Mask Abrasion Resistance | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage Value | 50-330V | 50-330V |
Our mission is to develop a solution that complies with the regulations in force in the regions we serve.
MAKROPCB
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