Single Faced CEM-1 PCB
Single Faced CEM-1 PCB
| Parameter | Mass Production | Prototype Production |
| Number of Layers | 1-18 Layer PCB | 1-56 Layer PCB |
| Raw Material | FR-4, Metal Based PCB (Aluminum, Copper etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
FR-4, Metal Based PCB (Aluminum, Copper etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
| Max. Panel Size | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L |
| Max. PCB Thickness | 8.5mm | 8.5mm |
| Min. PCB Thickness | 2L: 0.3mm | 2L: 0.1mm |
| 4L: 0.4mm | 4L: 0.3mm | |
| 6L and above: 0.8mm | 6L and above: 0.8mm | |
| Min. Inner Layer Opening | 3 miles | 3 miles |
| Min. Path Thickness | 3/3 miles | 3/3 miles |
| Min. Road Distance | 3/3 miles | 3/3 miles |
| Min. Hole Diameter | 0.1mm | 0.1mm |
| Min. PTH Thickness | 25 μm | 25 μm |
| Min. Blind/Buried VIA Size | 0.1mm | 0.1 mm (1-18 Layers) |
| PTH Diameter Tolerance | ±0.076mm (±3mil) | ±0.076mm (±3mil) |
| NPTH Diameter Tolerance | ±0.05mm (±2mil) | ±0.05mm (±2mil) |
| Hole Deviation Value | ±0.05mm (±2mil) | ±0.05mm (±2mil) |
| Thick Copper Options | 6 OZ/175 μm | 13OZ/455 μm |
| Min. S/M | 0.1mm (4mil) | 0.1mm (4mil) |
| Solder Mask Color | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple |
| Material Print Color | White, Black, Yellow, Red, Gray | White, Black, Yellow, Red, Gray |
| Surface Coating | HASL, Lead-Free HASL (Lead-Free Solder), Imitation Gold (ENIG), OSP (Organic), Solid Gold, ENEPIG, Imitation Silver, Imitation Tin, None (Lean Copper) | HASL, Lead-Free HASL (Lead-Free Solder), Imitation Gold (ENIG), OSP (Organic), Solid Gold, ENEPIG, Imitation Silver, Imitation Tin, None (Lean Copper) |
| Environmental Segment | CNC Routing, V-Groove, Beveling Punch, Chamfering | CNC Routing, V-Groove, Beveling Punch, Chamfering |
| Peripheral Cut Tolerance | Up to 1.0 mm ±0.1 mm, over 1.0 mm ±0.15 mm (±6mil) | Up to 1.0 mm ±0.1 mm, over 1.0 mm ±0.15 mm (±6mil) |
| Peelable Mask (Peelable) | Top, Bottom, Double-Sided | Top, Bottom, Double-Sided |
| VIA Techniques | Tented, Open, Plugged, In-Pad Via, Filled Via (Resin filled) | Tented, Open, Plugged, In-Pad Via, Filled Via (Resin filled) |
| Advanced Features | Half Covered Hole, Halogen Free, Edge Coated, Custom Stack-Up Press-Fit Perforated, Carbon Mask, Countersunk Perforated, Black Core Raw Material |
Half Covered Hole, Halogen Free, Edge Coated, Custom Stack-Up Press-Fit Perforated, Carbon Mask, Countersunk Perforated, Black Core Raw Material |
| Impedance Control | ± 10% | ±7% |
| Insulation Strength | 1×1012 Ω (Normal) | 1×1012 Ω (Normal) |
| Hole Coating Strength | <300 Ω (Normal) | <300 Ω (Normal) |
| Thermal Resistance | 3×10 sec@288℃ | 3×10 sec@288℃ |
| Advanced Features | Half Covered Hole, Halogen Free, Edge Coated, Custom Stack-Up Press-Fit Perforated, Carbon Mask, Countersunk Perforated, Black Core Raw Material |
Half Covered Hole, Halogen Free, Edge Coated, Custom Stack-Up Press-Fit Perforated, Carbon Mask, Countersunk Perforated, Black Core Raw Material |
| Impedance Control | ± 10% | ±7% |
| Insulation Strength | 1×1012 Ω (Normal) | 1×1012 Ω (Normal) |
| Hole Coating Strength | <300 Ω (Normal) | <300 Ω (Normal) |
| Thermal Resistance | 3×10 sec@288℃ | 3×10 sec@288℃ |
