Special Material PCB (HDI, Ceramic, Rogers, Taconic, Arlon, Nelco etc.)
Special Material PCB (HDI, Ceramic, Rogers, Taconic, Arlon, Nelco etc.)
| Parameter | Mass Production | Prototype Production |
| Layer Count | 1-18 Layer PCB | 1-56 Layer PCB |
| Raw Material | FR-4, Metal-Based PCB (Aluminum, Copper, etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
FR-4, Metal-Based PCB (Aluminum, Copper, etc.), HDI, High TG, Teflon CEM-1, CEM-2, CEM-3, Rogers, Polyimide Flex (PI), PET (Transparent) |
| Max. Panel Size | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L | 600*770 mm (23.62″ x 30.31″) for 2L+, 500*1200 mm (19.69″ x 47.24″) for 1L |
| Max. PCB Thickness | 8.5 mm | 8.5 mm |
| Min. PCB Thickness | 2L: 0.3 mm | 2L: 0.1 mm |
| 4L: 0.4 mm | 4L: 0.3 mm | |
| 6L and above: 0.8 mm | 6L and above: 0.8 mm | |
| Min. Inner Layer Clearance | 3 mil | 3 mil |
| Min. Trace Width | 3/3 mil | 3/3 mil |
| Min. Trace Spacing | 3/3 mil | 3/3 mil |
| Min. Hole Diameter | 0.1 mm | 0.1 mm |
| Min. PTH Thickness | 25 μm | 25 μm |
| Min. Blind/Buried VIA Size | 0.1 mm | 0.1 mm (1-18 Layer) |
| PTH Diameter Tolerance | ±0.076 mm (±3mil) | ±0.076 mm (±3mil) |
| NPTH Diameter Tolerance | ±0.05 mm (±2mil) | ±0.05 mm (±2mil) |
| Hole Position Deviation | ±0.05 mm (±2mil) | ±0.05 mm (±2mil) |
| Thick Copper Options | 6 OZ/175 μm | 13 OZ/455 μm |
| Min. S/M | 0.1 mm (4mil) | 0.1 mm (4mil) |
| Solder Mask Color | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple | Green, Blue, Red, White, Black, Matte Green, Matte Black, Purple |
| Legend Ink Color | White, Black, Yellow, Red, Gray | White, Black, Yellow, Red, Gray |
| Surface Finish | HASL, Lead-Free HASL, ENIG, OSP, Hard Gold, ENEPIG, Immersion Silver, Immersion Tin, None (Bare Copper) | HASL, Lead-Free HASL, ENIG, OSP, Hard Gold, ENEPIG, Immersion Silver, Immersion Tin, None (Bare Copper) |
| Routing Methods | CNC Routing, V-Groove, Beveling Punch, Chamfering | CNC Routing, V-Groove, Beveling Punch, Chamfering |
| Routing Tolerance | Up to 1.0 mm: ±0.1 mm, Above 1.0 mm: ±0.15 mm (±6mil) | Up to 1.0 mm: ±0.1 mm, Above 1.0 mm: ±0.15 mm (±6mil) |
| Peelable Mask | Top, Bottom, Double-Sided | Top, Bottom, Double-Sided |
| VIA Techniques | Tented, Open, Plugged, Pad-in-Via, Filled Via (Resin Filled) | Tented, Open, Plugged, Pad-in-Via, Filled Via (Resin Filled) |
| Advanced Features | Half Plated Hole, Halogen-Free, Edge Plating, Special Stack-Up Press-Fit Hole, Carbon Ink, Via Plugged with Copper Cap, Black Core Material |
Half Plated Hole, Halogen-Free, Edge Plating, Special Stack-Up Press-Fit Hole, Carbon Ink, Via Plugged with Copper Cap, Black Core Material |
| Impedance Control | ± 10% | ± 7% |
| Insulation Resistance | 1×1012 Ω (Normal) | 1×1012 Ω (Normal) |
| Hole Plating Resistance | <300 Ω (Normal) | <300 Ω (Normal) |
| Thermal Endurance | 3×10 sec@288℃ | 3×10 sec@288℃ |
| Bending/Flexing Tolerance | ≤0.7% | ≤0.7% |
| Electric Strength | >1.3 KV/mm | >1.4 KV/mm |
| Peel Strength | 1.4 N/mm | 1.4 N/mm |
| Solder Mask Abrasion Resistance | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage Value | 50-330V | 50-330V |
Our mission is to develop a solution that complies with the regulations in force in the regions we serve.
MAKROPCB
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